Low Latency Fiber Optic Links

The rapid evolution of AI-driven applications, real-time data processing, and ultra-high-definition content delivery is fueling unprecedented demand for next-generation data centers and ultra-low-latency networking infrastructure. To meet these challenges, the industry requires advanced Ethernet communication interfaces that deliver not only higher capacity and bandwidth but also unmatched efficiency, scalability, and minimal power consumption—all while supporting the rigorous demands of AI workloads and high-frequency trading. Our world-class design team combines decades of expertise in RF analog, mixed-signal, and advanced CMOS/SiGe technologies with a deep understanding of AI acceleration and real-time signal processing. This unique blend of skills enables Tetra Semi to collaborate closely with customers—from early co-design phases to high-volume production—delivering tailored solutions that push the boundaries of performance and efficiency.
With our core values of Simplicity, Flexibility, and Commitment, Tetra Semiconductors ensures faster time-to-market, optimized module costs, and superior yields, making us the partner of choice for the most demanding high-speed communication challenges.

Latest News

Tetra Semiconductors Achieves Milestone with Industrialization of Advanced PAM4 Chipsets

Posted: 2025-06-05

Zurich, Switzerland — June 6, 2025 Tetra Semiconductors , a leader in the semiconductor industry specializing in analog integrated circuits for the optical communications sector, proudly announces a significant milestone in its journey of innovation and excellence. The company has successfully achieved the industrialization of its radiation-tolerant, linear, and re-timed 53Gbit/s PAM4 chipset, as well […]

Products

Tetra’s chipsets target a range of applications in the datacom, space& aerospace, consumer and T&M markets.

Chipset	Datacom	Consumer	T&M	Radiation Tolerant
TS0 Chipset		HDMI AOC
TS1 Chipset			PAM4 T&M
TS2 Chipset	200G/400G Ethernet			YES
TS3 Chipset	PCI Express Gen 5/6 AOC
TS4 Chipset	400G/800G Ethernet

TS0 Chipset

The demand for ultra-high-definition video, immersive gaming, and real-time content creation is driving the need for advanced connectivity solutions. The latest HDMI 2.1 and DisplayPort 2.1 standards deliver unprecedented data rates—up to 48Gbps and 80Gbps, respectively—enabling 8K resolution, high dynamic range (HDR), and seamless multi-display setups. However, achieving these performance levels in Active Optical Cables (AOCs) requires innovative, power-efficient chipsets that eliminate the need for bulky external power sources.

Tetra Semiconductors Ltd. addresses this challenge with its TS0 chipset, a cutting-edge solution designed for ultra-low power consumption. The TS0 empowers HDMI AOC manufacturers to build high-performance, plug-and-play cables that support the latest standards without compromising on reliability or form factor. By integrating the TS0, manufacturers can deliver thinner, lighter, and more energy-efficient cables, ideal for consumer electronics, professional AV systems, and high-end gaming setups.

With decades of expertise in high-speed analog and mixed-signal design, Tetra Semi provides the technology and support to bring next-generation HDMI and DisplayPort solutions to market faster. Our commitment to simplicity, flexibility, and performance ensures that partners can meet the growing demands of bandwidth-intensive applications while keeping costs low and yields high.

Part	Type	Description	Market	availability
TSR0HDMI	4 channel 16Gbit/s NRZ Receiver	The TSR0HDMI includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a selectable	HDMI 2.1, DP 1.4, 10/40Gbit/s Ethernet	available
TST0HDMI	4 channel 16Gbit/s NRZ VCSEL Driver	The TST0HDMI includes a VCSEL driver at the output and a selectable TMDS or CML input.	HDMI 2.1, DP 1.4, 10/40Gbit/s Ethernet	available

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TS1 Chipset

Part Name	Functionality	Description	Application	Availability
TSC1ENC	14/28/56GBaud PAM4 Encoder	The TSC1ENC converts two NRZ signal inputs into a single PAM4 signal of the same baud rate at the output. The chip can operate at input bit rates of 56Gbit/s, 28Gbit/s, and 14Gbit/s.	Test & Measurement	available
TSC1DEC	14/28/56GBaud PAM4 Decoder	The TSC1DEC converts a PAM4 signal input into two NRZ signals of the same bit rate at the output. The chip can operate at input baud rates of 56Gbaud/s, 28Gbaud/s, and 14Gbaud/s.	Test & Measurement	available
TSC1MUX	14/28/56Gbit NRZ multiplexer	The TSC1MUX converts two NRZ signal inputs into one NRZ signal of double the bit rate at the output. The chip can operate at input bit rates of 28Gb/s and 14Gb/s.	Test & Measurement	available
TSC1DEM	14/28/56Gbit NRZ Demux	The TSC1DEM converts a NRZ signal input into two NRZ signals of half the bit rate at the output. The chip can operate at input bit rates of 56Gb/s, 28Gb/s, and 14Gb/s.	Test & Measurement	available
TSC1REP	14/28/56Gbit NRZ Dual Channel Repeater	The TSC1REP retimes the two NRZ signal inputs, individually. The chip can operate at input bit rates of 56Gb/s, 28Gb/s, and 14Gb/s.	Test & Measurement	available

Related news:

53 Gbaud PAM4 (100G) Link Demonstrated Using an Analog CDR Technology

Posted: 2019-11-18

Zurich, November 18th, 2019 Tetra Semiconductors Is Partnering with Munich Instruments to Demonstrate a Link at 53 Gbaud PAM4 Using Tetra’s TS1 Chipset. Tetra Semiconductors Ltd., Zürich, a leading supplier of datacom and test&measurement chipsets and Munich Instruments, Munich, demonstrate the first (to our knowledge) analog CDR based (DSP-less) 53 GBaud electrical Link. The link […]

Munich Instruments and Tetra Semiconductors introduce Cost-Efficient PAM-4 Test&Measurement Solutions

Posted: 2018-03-09

Munich, March 9th, 2018 Munich Instruments GmbH, Munich, Germany and Tetra Semiconductors Ltd., Zurich, Switzerland today announced the availability of a wide portfolio of PAM-4 T&M products, providing high-performance solutions with the cost-effectiveness required in production test environments and the development cycle of low cost PAM-4 products. Munich Instruments’ extends its product range by the […]

TS2 Chipset

TS2 Chipset: Specialized for 200G and 400G Ethernet, the TS2 is optimized for short-reach applications in data centers, high-performance computing, and aerospace. It supports multiple operational modes—CDR, linear bypass, and NRZ bypass—providing flexibility for diverse system requirements. The TS2 is also available in a radiation-tolerant version, making it suitable for harsh environments such as space and satellite communications, where reliability and fault tolerance are paramount

Part Name	Product Type	Description	Market Segment	Availability
TSC2PAM	4 channel 28Gbaud PAM4 Repeater	The TSC2PAM includes a linear 50 Ohm Input and a 50 Ohm output stage to drive differential swings up to 1.4V. The chip can operate at input baud rates of up to 28Gbaud.	200G/400G Ethernet	available
TSR2PAM	4 channel 28Gbaud PAM4 Receiver	The TSR2PAM includes a linear TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input baud rates of up to 28Gbaud.	200G/400G Ethernet	available
TST2PAM	4 channel 28Gbaud PAM4 Transmitter	The TST2PAM includes a PAM VCSEL driver at the output and a CDR Retimer with a 50 Ohm Input. The chip can operate at input baud rates of up to 28 Gbaud.	200G/400G Ethernet	available

Related news:

Tetra Semiconductors Achieves Milestone with Industrialization of Advanced PAM4 Chipsets

Posted: 2025-06-05

Tetra Semiconductors to extend its PAM4 technology to space

Posted: 2022-01-24

Zurich, January 24, 2022 Data traffic within satellites, launchers and space stations is constantly growing as, for example, sensors and camera resolutions increase from generation to generation. Thus, new, faster, and more efficient (in terms of energy per transmitted bit) intra-satellite data transmission is required. We are proud to announce that Tetra Semiconductors has been […]

Tetra Semiconductors’ analog PAM4 CDR

Posted: 2020-10-22

Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing 8-channel 400Gb Ethernet optical modules. While matching all RF performance requirements of Ethernet modules, Tetra’s new CDR offers a significantly lower power consumption and BOM costs at much smaller size than DSPs. Thus, the TSC2PAM […]

Tetra Semiconductors’ Sample of the New PAM4 200/400G Ethernet Transceiver Chipset Now Available

Posted: 2020-03-05

Zurich, March 5, 2020 Tetra Semiconductors Ltd., Zurich, Switzerland announces their new TS2 Transceiver Chipset for 200G/400G Ethernet SR/LR applications is now available. The chipset combines outstanding performance with minimal power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ transeiver chipset includes 4 Channel PAM4 VCSEL Drivers and 4 Channel PAM4 TIAs […]

Tetra Semiconductors Announces Very Low Power Chipset for 200/400G Ethernet

Posted: 2018-09-14

Zurich, September 13th, 2018 Tetra Semiconductors Ltd., Zurich, Switzerland today announced the TS2 Chipset for 200G/400G Ethernet SR/LR applications. The chipset combines outstanding performance at a minimum power consumption and offers the cost-effectiveness required to build competitive 200G/400G optical modules. Tetra Semiconductors’ chipset includes a 4 Channel PAM4 VCSEL Driver, 4 Channel PAM4 TIAs as […]

TS3 Chipset

Part Name	Product Type	Description	Market Segment	Availability
TSR3PAM	4 channel 32Gbit/s NRZ/PAM Receiver	The TSR3PAM includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input bit rates of up to 64 Gbit/s.	PCI Express	Q1 2026
TST3PAM	4 channel 32 Gbit/s NRZ/PAM Transmitter	The TST3PAM includes a VCSEL driver at the output and a CDR Retimer with a 50 Ohm Input. The chip can operate at input bit rates of up to 64 Gbit/s.	PCI Express	Q1 2026

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TS4 Chipset

Part Name	Type	Description	Market	Availability
TSR4PAM	4 channel 106 Gbit/s PAM Receiver	The TSR4PAM includes a TIA at the input to convert currents coming from a Photo Diode into a differential signal followed by a CDR Retimer with a 50 Ohm Output. The chip can operate at input bit rates of up to 106 Gbit/s. It can be operated in a low Power linear bypass mode, or in re-timed mode forbetter link margin.	400/800G Ethernet	available
TST4PAM	4 channel 106 Gbit/s PAM Transmitter	The TST4PAM includes a VCSEL driver at the output and a CDR Retimer with a 50 Ohm Input. The chip can operate at input bit rates of up to 112 Gbit/s. It can be operated in a low Power linear bypass mode, or in re-timed mode for better link margin.	400/800G Ethernet	available
TSC4PAM	4 channel 106 Gbit/s PAM Transmitter	The TSC4PAM includes a Modulator driver at the output and a CDR Retimer with a 50 Ohm Input. The chip can operate at input bit rates of up to 112 Gbit/s. It can be operated in a low Power linear bypass mode, or in re-timed mode for better link margin.	400/800G Ethernet	available

Tetra Semiconductors Achieves Milestone with Industrialization of Advanced PAM4 Chipsets

Posted: 2025-06-05

Tetra Semiconductors congrats the NICT B5G BRIGHTEN project

Posted: 2025-05-13

Tetra Semiconductors congrats the NICT (The National Institute of Information and Communications Technology) B5G (Beyond 5G) BRIGHTEN project (J012368C00101, J012368C07901) for the invited paper which will be published on Journal of Lightwave Technology “An Ultra-Compact CPO Transceiver based on a 1060-nm Single-Mode VCSEL Array and Multicore Fibers” (Early access available at IEEE Explore). The NICT B5G BRIGHTEN project selected Tetra Semiconductors’ 16-channel SR […]

Services

We combine unique expertise into a complete offering team comprises:

A unique know-how in Front-End and CDR circuit design, as well as design for testability

Over 60 years experience in the RF mixed-signal low-power IC industry

We offer

Customer Centric Mindset

A continuous customer interaction throughout the chip design phase promotes a successful and
flexible usage of our standard products.

Design Support

Our aim is to shorten your development time always considering costs, reliability and yield of the target product.

Production Support

With our wide background ranging from R&D to production lean management, we can assist you in:

Ramping up your production line

Maintaining high yields during production

Creating a lean and efficient production line

Team

Jörg Wieland, Chairman

35+ years of semiconductor leadership as
Chairman, CEO, and GM, building profitable
businesses and leading global operations. Former ETH Zürich researcher with expertise in product engineering, ISO systems, and pioneering optical interconnects.

Denis Müller, Product Manager

20+ years in global business and project
leadership, delivering reliable solutions
worldwide. Expert in mixed-signal ICs,
electro-optical integration, and supply chain
optimization.

Martin Bossard, CEO

Early contributor to broadband com-munications and expert in mixed-signal electronics and electro-optical integration. Led market-proven product design teams as General Manager. Holds several patents; inventor of high-speed, ultra-low-power data transmission circuits.