Tetra Semiconductors’ analog PAM4 CDR
Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing
Read MoreEnabling 800G interconnects
Zurich, October 22, 2020 Tetra Semiconductors Ltd. proudly announces their 4-channel CDR chip TSC2PAM designed to replace DSPs in existing
Read MoreZurich, March 5, 2020 Tetra Semiconductors Ltd., Zurich, Switzerland announces their new TS2 Transceiver Chipset for 200G/400G Ethernet SR/LR applications is now
Read MoreZurich, November 18th, 2019 Tetra Semiconductors Is Partnering with Munich Instruments to Demonstrate a Link at 53 Gbaud PAM4 Using
Read MoreZurich, September 13th, 2018 Tetra Semiconductors Ltd., Zurich, Switzerland today announced the TS2 Chipset for 200G/400G Ethernet SR/LR applications. The
Read MoreMunich, March 9th, 2018 Munich Instruments GmbH, Munich, Germany and Tetra Semiconductors Ltd., Zurich, Switzerland today announced the availability of
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